The objective of the Poussyere project is to develop an innovative technology that allows the assembly of at least four standard chips, or even encapsulated chips, in miniature "Micro Leadframe Package" (MLP) packages.
The contribution by the Microtechnology and Bioinstrumentation competence group to this project enabled the development of flexible circuit technology manufactured by ink printing according to a smart manufacturing process based on different inks and distinguished from inkjet printing: pad printing or micro-stamping.
More specifically, it was possible to demonstrate the feasibility of manufacturing a flexible circuit, to validate various key functions that the conductor tracks must be able to fulfil, to characterise the performance of this technology and finally to test the application of this technology to the manufacture of a highly miniaturised circuit that can fit into a cube of less than 1 cm3.
Project partner(s)
Project leader - team
Philippe Passeraub
(HEPIA),
René Beuchat
(HEPIA),
Lyes Choulak (HEPIA)
,
Adyl El Guamra (HEPIA)